- 您的位置:
- 中国标准在线服务网 >>
- 全部标准分类 >>
- 国际标准 >>
- 31.200 >>
- IEC 60748-20:1988/AMD1:1995 EN-FR e2f88f62

【国际标准】 Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
本网站 发布时间:
2024-05-13
- IEC 60748-20:1988/AMD1:1995 EN-FR
- 现行
选择类型:
电子版: 84元
/ 折扣价:
76 元
开通会员免费在线看70000余条国内标准,赠送文本下载次数,单本最低仅合13.3元!还可享标准出版进度查询、定制跟踪推送、标准查新等超多特权!  
查看详情>>

适用范围:
暂无
标准号:
IEC 60748-20:1988/AMD1:1995 EN-FR
标准名称:
Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
英文名称:
Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits标准状态:
现行-
发布日期:
1995-09-22 -
实施日期:
出版语种:
EN-FR
- 推荐标准
- 国家标准计划
- IEC 61967-8:2023 EN-FR ed616268 Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
- IEC 63011-1:2018 EN-FR c9ed72f3 Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
- IEC 63011-2:2018 EN-FR ad50ed8b Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
- IEC 63011-3:2018 EN-FR 5e76d4d5 Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via
- IEC 62228-1:2018 EN 43af3dd0 Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions
- IEC 62228-1:2018 EN-FR 8133d971 Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions
- IEC 61967-8:2011 EN-FR 87510003 Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
- IEC TS 62433-1:2011 EN-FR 5f93f8dd EMC IC modelling - Part 1: General modelling framework
- IEC 61967-6:2002/AMD1:2008 EN-FR 6142d83b Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
- IEC 62132-3:2007 EN-FR 7819cce2 Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method
- IEC 61967-4:2002/AMD1:2006 EN-FR 7e911bd1 Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method
- IEC 60748-23-4:2002 EN 821aab13 Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification
- IEC TS 61945:2000 EN-FR 71f48134 Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis
- IEC TS 61944:2000 EN-FR 9f15e4cd Integrated circuits - Manufacturing line approval - Demonstration vehicles
- IEC 61964:1999 EN-FR 1d83caad Integrated circuits - Memory devices pin configurations